During my research I found the Pagopace payment ring, which is essentially a contactless payment device that you can link to a normal credit card and which—according to Pagopace—can work for longer than 5 years.
Is there any implant that uses the same technology? Would it be possible to make a glass-encapsulated implant with the same chip used in their ring?
Thanks — that’s useful. Quick question: when you say “not in glass,” are you referring mainly to antenna issues, or to provisioning/secure-element limitations? Have you tried this in practice or talked to any glass manufacturers like schott about encapsulation? Appreciate any pointers.
It’s a manufacturing problem really. Depending on what Pagopace product you’re talking about it will have a MOB packaged P71 from NXP or an Infineon SPA2.1 SecoraPay X module inside. Both of these have different challenges one-offing a conversion into glass.
If you are interested in funding mass production, or the expensive possibility of purchasing the fixed assets necessary to do a one-off for you, we can discuss the possibilities. Otherwise, flex conversion is your only realistic option.