all i could get with my phone is that it’s ISO7816 Infineon Technologies.
updated the post above with this info.
from what i see, i think the best approach would be to just encapsulate this thing as is. the range seems to be pretty nice! should work great even when encapsulated and implanted.
my only concern is the thickness and rigidness.
i don’t know how much thickness encapsulation would add, but let’s say the result would be around 26x16x2 mm, rigid.
this is shorter, same thickness and only 5 mm wider than the PCB i have in P5 now, so i think it would be pretty comfortable there. but i’ve heard implants break there??
for P4 i’m not sure if such a thick rigid thing would be nice. it would probably protrude and make my hand look meh :<