Question about future products

Hmm, That depends on what you are trying to do and how you are doing it and with what.
For example if you are just writing NDEF to the HF side with NXP TagWriter, you should have no issues, however if you are using NFC Shell commands with an ACR122, you could easily brick it. :brick:

The T5577 chip on the LF side has password protection functions to block reconfiguration by accident or malicious attack. however the T5577 does not support “tear protection”

Here is a great write up you will find in the faq section

Whatever you are going to do to your implants, it is a good idea to practice on your stickers or test cards first,

DT normally have NTAG216 HF stickers ( same chip as NExT ) , but they are currently out of stock, (Probably being used up for the FlexNExTs

You can get a really good test card pack from KSEC which covers all the implant options from the DT store

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